BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb1. Crafted with high quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications. 2. Made with halide free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks. 3. No Clean, Low Residue
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BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb